Top 7 China Semiconductor Equipment Companies 2025
China's semiconductor equipment market reached RMB 350 billion in 2025, fueled by urgent import substitution demand and massive domestic fab construction. Despite US export controls restricting access to advanced EUV lithography and leading-edge etching tools, Chinese equipment companies like Naura, AMEC, and SMEE are rapidly closing the technology gap, with domestic equipment adoption in new Chinese fabs exceeding 40%.
TL;DR: China's semiconductor equipment market reaches RMB 350B. Naura (北方华创) leads with etching/deposition tools for 28nm production while AMEC provides CMP and MOCVD equipment. SMEE is developing domestic DUV lithography. Domestic equipment adoption exceeds 40% in new Chinese fabs.
Top Companies
Naura Technology (北方华创)
28nm production verifiedNaura is China's largest semiconductor equipment company, offering etching, PVD, CVD, and annealing tools. Its products support 28nm production and are being extended to 14nm. Naura serves SMIC, Hua Hong, and other Chinese fabs, with revenue exceeding RMB 30 billion.
AMEC (中微公司)
5nm etching capabilityAMEC develops advanced plasma etching and MOCVD equipment. Its CCP etching tools have demonstrated 5nm process capability, used by TSMC and leading logic fabs. AMEC's MOCVD tools dominate the LED manufacturing market with over 60% global market share.
SMEE (上海微电子)
Domestic DUV lithographySMEE is China's only lithography machine manufacturer, developing DUV step-and-scan systems for 90nm processes. While still trailing ASML in resolution, SMEE's tools are used in mature-node production for automotive, power, and MEMS chips. Advanced DUV development is ongoing.
Kingsemi (拓荆科技)
PECVD equipment leaderKingsemi specializes in PECVD and ALD (atomic layer deposition) equipment for semiconductor manufacturing. Its tools serve front-end processes including dielectric film deposition for 28nm and below, with growing adoption in Chinese logic and memory fabs.
ACM Research (盛美半导体)
Leading Chinese CMPACM Research develops advanced wafer cleaning, CMP (chemical mechanical planarization), and plating tools. Its SAPS cleaning technology achieves sub-2nm particle removal efficiency, deployed in major Chinese and international fabs including SMIC and Yangtze Memory Technologies.
Mattson Technology ( Mattson/中国)
RTP and annealing toolsMattson provides rapid thermal processing (RTP), annealing, and batch furnaces for semiconductor manufacturing. Acquired by Chinese investors, it serves Chinese fabs with cost-competitive thermal processing solutions for 28nm and mature node production.
U-Precision (华海清科)
CMP + wafer cleaningU-Precision develops CMP equipment and post-CMP cleaning tools for Chinese semiconductor fabs. Its CMP tools are used in 28nm production at SMIC and Hua Hong, with advanced CMP development targeting 14nm node requirements for logic and memory applications.
Comparison Table
| Company | Equipment Type | Technology Node | Key Customers | Revenue (RMB B) |
|---|---|---|---|---|
| Naura | Etch, PVD, CVD, anneal | 28nm (extending 14nm) | SMIC, Hua Hong | 30+ |
| AMEC | CCP etch, MOCVD | 5nm etch demonstrated | TSMC, SMIC | 8+ |
| SMEE | DUV lithography | 90nm (advanced in dev) | Mature node fabs | 5+ |
| Kingsemi | PECVD, ALD | 28nm and below | Logic, memory fabs | 5+ |
| ACM Research | CMP, cleaning, plating | 28nm | SMIC, YMTC | 5+ |
| Mattson | RTP, annealing, furnace | 28nm | Chinese fabs | 3+ |
| U-Precision | CMP, post-CMP clean | 28nm (targeting 14nm) | SMIC, Hua Hong | 3+ |
Frequently Asked Questions
Can China make its own lithography machines?
China's SMEE produces DUV lithography tools for 90nm processes, but still relies on ASML for advanced DUV and EUV lithography. Closing this gap is a national priority with massive R&D investment, but achieving EUV-level capability is estimated to take 5-10 years. SMEE's advanced DUV development is ongoing.
How much semiconductor equipment does China import?
China imports over 70% of its semiconductor equipment, primarily from Japan, the Netherlands (ASML), and the US. However, domestic equipment adoption is rising rapidly, exceeding 40% in new fab construction. China's equipment import substitution drive aims to reach 70% domestic sourcing by 2030.
What is the impact of US export controls on China?
US export controls restrict China's access to advanced EUV lithography, leading-edge etching tools, and high-end deposition equipment. This has accelerated China's domestic equipment development but created near-term bottlenecks for sub-7nm chip production. Chinese companies are adapting by optimizing mature-node processes.
Which Chinese company has the best etching technology?
AMEC (中微公司) has demonstrated 5nm etching capability and supplies TSMC and leading global fabs, making it China's most internationally competitive equipment company. Naura (北方华创) also provides competitive etching tools for 28nm production with growing 14nm capability.
How fast is China's semiconductor equipment industry growing?
China's semiconductor equipment market is growing at 25-30% annually, reaching RMB 350 billion in 2025. Equipment companies like Naura and AMEC have seen revenue double in the past three years. Government subsidies, fab construction, and import substitution policies drive continued rapid growth.